Compact housing for portable electronic device with internal speaker

ABSTRACT

Improved approaches for providing a speaker within a housing of a portable electronic device are disclosed. The housing of the portable electronic device can be compact, such as a low profile housing. In one embodiment, an acoustic chamber for a speaker can be formed internal to a housing for a portable electronic device using non-dedicated space. In another embodiment, irregular surfaces can be sealed so that an acoustic chamber for a speaker can be formed internal to a housing for a portable electronic device.

CROSS-REFERENCE TO OTHER APPLICATION

This application is a divisional application of U.S. patent applicationSer. No. 12/240,519, filed Sep. 29, 2008, entitled “COMPACT HOUSING FORPORTABLE ELECTRONIC DEVICE WITH INTERNAL SPEAKER”, which is herebyincorporated herein by reference, and which in turn claims priority toU.S. Provisional Patent Application No. 61/094,816, filed Sep. 5, 2008,entitled “COMPACT HOUSING FOR PORTABLE ELECTRONIC DEVICE WITH INTERNALSPEAKER”, which is hereby incorporated herein by reference.

This application also references U.S. Provisional Patent Application No.61/094,811, filed Sep. 5, 2008, entitled “ELECTROMAGNETIC INTERFERENCESHIELDS WITH PIEZOS”, which is hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION

Conventionally, a dedicated area within an electronic device housing isused to provide a chamber for a speaker. The speaker is utilized by theelectronic device to produce audio sound for the benefit of the user ofthe electronic device. For example, the speaker can produce audio soundscorresponding to music, movies or speech. Unfortunately, however, aselectronic devices become increasingly more compact, the availability ofspace within a housing for a compact electronic device becomes morelimited. Accordingly, given the constrained geometries and tighttolerances of compact portable electronic devices, such as handheldportable electronic devices, it is increasingly difficult to provide aspeaker with a desired acoustic chamber.

Piezoelectric speakers are often used in compact portable electronicdevices, such as portable media players and mobile telephones, becauseof their low profile and relatively small footprint. Piezoelectricspeakers create sound by forming vibrations with a diaphragm via apiezoelectric driver. In general, the sound quality associated withpiezoelectric speakers is adequate, but is often not to the level thatmay be desired in particular applications. The sound quality associatedwith piezoelectric speakers may be worsened by the actual placement ofthe piezoelectric speakers within electronic devices. That is, thelocation at which a piezoelectric speaker is placed may not be alocation which is not substantially optimal for the performance of thepiezoelectric speaker. Piezoelectric speakers are often placed whereverthey fit within electronic devices, without regard for whether theplacement of the piezoelectric speakers provides substantially the bestsound quality that may be achieved by the piezoelectric speakers.

Thus, there is a need for improved techniques for forming an acousticchamber for a speaker, such as a piezoelectric speaker, within anelectronic device housing.

SUMMARY

The invention pertains to improved approaches for providing a speakerwithin a housing of a portable electronic device. The housing of theportable electronic device can be compact, such as a low profilehousing. The portable electronic device can pertain to a portabledigital media player, a mobile telephone, personal digital assistant,etc.

According to one aspect of certain embodiments of the invention, anacoustic chamber (e.g., back volume) for a speaker can be formedinternal to a housing for a portable electronic device usingnon-dedicated space. According to another aspect of certain embodimentsof the invention, irregular surfaces can be sealed so that an acousticchamber for a speaker can be formed internal to a housing for a portableelectronic device. Advantageously, an acoustic chamber for a speaker canbe expanded and flexibly formed even within a low profile housing. Inone embodiment, the speaker can be a piezoelectric loudspeaker.

The invention may be implemented in numerous ways, including, but notlimited to, as a system, device, apparatus, or method. Exampleembodiments of the present invention are discussed below.

As a portable electronic device, one embodiment of the invention can,for example, include at least: a housing; a speaker provided in thehousing; a back volume for the speaker; and a front volume for thespeaker. The back volume is formed from an area within the housing thatis not dedicated to the back volume, and the front volume is formed froman area within the housing that is not dedicated to the front volume.

As a portable electronic device, another embodiment of the inventioncan, for example, include at least: a printed circuit board; electricalcomponents mounted on the printed circuit board; a EMI shieldingstructure attached to the printed circuit board and provided over one ofmore of the electrical components; a speaker attached to the EMIshielding structure; and a form-in-place seal used to at least in partform an acoustic chamber for the speaker.

As a method for assembling a portable electronic device having aninternal acoustic back volume, one embodiment of the invention can, forexample, include at least: obtaining a printed circuit board; attachingelectrical components to the printed circuit board; attaching an EMIshielding can to the printed circuit board such that the EMI shieldingcan is placed over one or more of the attached electrical components;attaching a speaker to the EMI shielding can; applying a form-in-placesealant to one or more particular locations of the assembled printedcircuit board; curing the form-in-place sealant; and thereafterassembling the portable electronic device such that the assembledprinted circuit board is provided within a housing of the portableelectronic device and such that the internal acoustic back volume isformed within the portable electronic device housing and coupled to thespeaker.

As a portable electronic device, still another embodiment of theinvention can, for example, include at least: a housing; electricalcomponents provided within the housing; an internal structure providedwithin the housing; a speaker provided within the housing and attachedto the internal structure; and a form-in-place seal provided within thehousing, the form-in-place seal being used to at least in part form anacoustic chamber for the speaker.

Various aspects and advantages of the invention will become apparentfrom the following detailed description taken in conjunction with theaccompanying drawings which illustrate, by way of example, theprinciples of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, in which:

FIG. 1 is a simplified sectional side view of a portable electronicdevice housing according to one embodiment of the invention.

FIG. 2 is a simplified sectional side view of a portable electronicdevice housing according to another embodiment of the invention.

FIG. 3 is a simplified sectional side view of a portable electronicdevice housing according to one embodiment of the invention.

FIG. 4A is an upper perspective view of a board assembly according toone embodiment of the invention.

FIG. 4B is an upper perspective view of a board assembly according toanother embodiment of the invention.

FIG. 4C is a simplified sectional side view of a portable electronicdevice housing according to one embodiment of the invention.

FIG. 5A is an upper perspective view of a board assembly according tostill another embodiment of the invention.

FIG. 5B is an upper perspective view of a board assembly according tostill another embodiment of the invention.

FIG. 6 is a flow diagram of an assembly process for a portableelectronic device according to one embodiment of the invention.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

The invention pertains to improved approaches for providing a speakerwithin a housing of a portable electronic device. The housing of theportable electronic device can be compact, such as a low profilehousing. The portable electronic device can pertain to a portabledigital media player, a mobile telephone, personal digital assistant,etc.

According to one aspect of certain embodiments of the invention, anacoustic chamber (e.g., back volume) for a speaker can be formedinternal to a housing for a portable electronic device usingnon-dedicated space. According to another aspect of certain embodimentsof the invention, irregular surfaces can be sealed so that an acousticchamber for a speaker can be formed internal to a housing for a portableelectronic device. Advantageously, an acoustic chamber for a speaker canbe expanded and flexibly formed even within a low profile housing. Inone embodiment, the speaker can be a piezoelectric loudspeaker.

Embodiments of the invention are discussed below with reference to FIGS.1-6. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these figures is forexplanatory purposes as the invention extends beyond these limitedembodiments.

FIG. 1 is a simplified sectional side view of a portable electronicdevice housing 100 according to one embodiment of the invention. Theportable electronic device housing 100 is a housing for a portableelectronic device. The portable electronic device housing 100 can be ofany material or combination of materials, such as metals, plastics, orceramics. Typically, the portable electronic device (and thus thehousing 100) is compact and highly portable, such as a handheldelectronic device.

The portable electronic device housing 100 includes an internalstructure 102 having a speaker 104 couples thereto. The internalstructure 102 can represent any suitable structure within the portableelectronic device housing 100. For example, the internal structure 102can pertain to a printed circuit board. As another example, the internalstructure 102 can pertain to an Electrical Magnetic Interference (EMI)shielding can (also known as a RF can). In one embodiment, the speaker104 can be a disc type speaker, such as a piezoelectric speaker. Thespeaker 104 can be secured with respect to the internal structure 102 byan adhesive seal 106. The seal 106 can be provided around the peripheryof the speaker 104 with respect to a front side of the speaker 104 thatis secured to the internal structure 102. In one embodiment, theadhesive seal 106 can be implemented by double-sided adhesive tape(e.g., VHB™ tape).

In addition, a first gasket 108 and a second gasket 110 can combine toform a back volume 112 adjacent a back side of the speaker 104. Thefirst gasket 108 and the second gasket 110 can create a seal above theback side of the speaker 104 and between the internal structure 102 andan inner surface of the housing 100. The first gasket 108 and the secondgasket 110 can rubber or other material that tends to be somewhatcompliant. A front volume 114 for the speaker 104 can also be formedwithin the portable electronic device housing 100. The back volume 112and the front volume 114 are isolated (or nearly isolated) volumes ofair that reside within an internal area of the portable electronicdevice housing 100.

The portable electronic device housing 100 also includes an opening 116.The opening 116 is adjacent the front volume 114 for the speaker 104.The opening 116 can be a dedicated opening for the speaker 104 or canalternatively be an opening provided for another purpose. In thisembodiment, the internal structure 102 will include at least one openingso that the front side of the speaker 104 can couple to the front volume114. Here, the sound waves produced by the speaker 104 can transmitthrough the front volume 114 and out of the opening 116 so that theresulting audio sound can be heard by a user (or bystander) associatedwith the portable electronic device.

As illustrated in FIG. 1, the back volume 112 is substantially sealedagainst the inner surface of the portable electronic device housing 100.However, since the back volume 112 includes essentially the volume ofair above the back surface of the speaker 104, the back volume 112 israther limited, particularly with portable electronic device housingsthat are compact, such as for handheld electronic devices. Sinceimproved fidelity might be achieved by a larger back volume, differentsealing configurations, arrangements or approaches can be used to obtaindifferent back volumes.

FIG. 2 is a simplified sectional side view of a portable electronicdevice housing 200 according to another embodiment of the invention. Theportable electronic device housing 200 is generally similar to theportable electronic device housing 100 illustrated in FIG. 1. However,the second gasket 110′ is positioned away from the speaker 104 so thatthe back volume 112′ is increased as compared to the back volume 112 inFIG. 1. While the first gasket 108 seals upward from the internalstructure 102 to an upper, inner surface of the portable electronicdevice housing 200, the second gasket 110′ seals downward from theinternal structure 102 to a lower, inner surface of the portableelectronic device housing 200.

FIG. 3 is a simplified sectional side view of a portable electronicdevice housing 300 according to one embodiment of the invention. Theportable electronic device housing 300 can represent a more detailedembodiment for the portable electronic device housing 200 illustrated inFIG. 2.

The portable electronic device housing 300 encloses a printed circuitboard 302. Various electrical components 304 are attached to the printedcircuit board 302. The electrical components 304 can pertain tointegrated circuits, analog devices (e.g., resistor, capacitor,transistor), etc. that are often utilized by portable electronicdevices. A battery 306 and a display 307, which can be consideredrelatively large electrical components, can also be attached to theprinted circuit board 302.

In addition, the portable electronic device housing 300 can include anElectrical Magnetic Interference (EMI) shielding can 308. The EMIshielding can 308 can also be referred to as an RF can. The EMIshielding can 308 can be mounted on the printed circuit board 302.Typically, the EMI shielding can 308 covers or encloses one or more ofthe electrical components 304 so as to reduce EMI emissions. A speaker310 can be coupled to an upper surface of the EMI shielding can 308. Inone embodiment, the speaker 310 can be a disc type speaker, such as apiezoelectric speaker. The speaker 310 can be secured with respect tothe EMI shielding can 308 by an adhesive seal 312. The adhesive seal 106can be provided around the periphery of the speaker 310 with respect toa front side of the speaker 310 that is secured to the EMI shielding can308. In one embodiment, the adhesive seal 106 can be double-sidedadhesive tape.

In addition, a first seal 314 and a second seal 316 can combine to forma back volume 318 behind a back side of the speaker 310. The first seal314 and the second seal 316 can create a seal between the back volume318 of the speaker 310 and a front volume 320 of the speaker 310. TheEMI shielding can 308 can include one or more openings 322 (e.g., holes)in its upper surface adjacent the speaker 310. The opening 320 enablessound waves induced by the speaker 310 to propagate into the EMIshielding can 308. The EMI shielding can 308 also include at least oneopening 324 that allows the sound waves from the speaker 310 to exit theEMI shielding can 308. The opening 324 is an opening of or into thefront volume 320. The portable electronic device housing 300 alsoincludes an opening 326. The opening 326 is coupled to the front volume320 for the speaker 310 so that sound waves generated by the speaker 310can exit the portable electronic device housing 300. The opening 326 canbe a dedicated opening for the speaker 310 or can alternatively be anopening provided for another purpose (e.g., connector opening).

Both the back volume 318 and the front volume 320 are formed internal tothe portable electronic device housing 310, though the internalcomponents and seals are used to substantially isolate the front volume320 from the back volume 318. For example, as illustrated in FIG. 3, ata minimum to isolate the front volume 320 from the back volume 318, thefirst seal 314 and the second seal 316 cooperate with portions of theEMI shielding can 308 and the printed circuit board 302.

FIG. 4A is an upper perspective view of a board assembly 400 accordingto one embodiment of the invention. The board assembly 400 has a printedcircuit board 402 as a base. Electrical components 404 are attached tothe printed circuit board 202 and are electrically interconnected viametal traces provided on the printed circuit board. The electricalcomponents 404 can pertain to integrated circuits, analog devices (e.g.,resistor, capacitor, transistor), etc. that are often utilized byportable electronic devices. A battery 406 can also be attached orplaced proximate to the printed circuit board 402. Still further, anElectro-Magnetic Interference (EMI) can 408 can be attached to theprinted circuit board 402. A speaker 410 can be coupled proximate to atop surface of the EMI can 408. An intermediate layer (not shown) can beprovided between the top surface of the EMI can 408 and the speaker 410.For example, the intermediate layer can pertain to a layer of adhesiveprovided around the periphery of the speaker 410 so as to secure andseal the front side of the speaker 410 to the top surface of the EMI can408. In one embodiment, the intermediate layer can be double-sidedadhesive tape.

The EMI can 410 can include one or more openings in a top surface (notshown, see FIG. 3) that enable sound waves produced by the speaker 410to enter the EMI can 408. The EMI can 408 is also substantially sealedwith respect to the printed circuit board 402 with the exception of anopening 412 in one side of the EMI can 408.

FIG. 4B is an upper perspective view of a board assembly 400 accordingto another embodiment of the invention. The board assembly 440 isgenerally similar to the board assembly 400 illustrated in FIG. 4A.However, the board assembly 440 further includes a barrier 442. When theboard assembly 440 is provided with a portable electronic devicehousing, the barrier 442 operates to seal with respect to one or moreinner sides of the portable electronic device housing. Consequently, thebarrier 442 provides a demarcation between a front volume and a backvolume for the speaker 410. Interestingly, the barrier 442 can beprovided over irregular surfaces, yet still provide a reliable seal. Forexample, as shown in FIG. 4B, the barrier 442 has it lower surfacesealed against a portion of the printed circuit board 402, the EMIshielding can 408 and the electrical components 404. The formation ofthe barrier 442 is such that the lower surface of the barrier 442 isable to be formed over the different heights. In one embodiment, asdiscussed in greater detail below, the barrier 442 can be formed from aliquid or gel that can easily conform to irregular surfaces, and canthen cure to a said form. The resulting barrier 442 not only sealsagainst the irregular surfaces but also typically remains compliant sothat it can be compressed against when forming a seal. In oneimplementation, the barrier 442 can be formed from a form-in-placematerial.

FIG. 4C is a simplified sectional side view of a portable electronicdevice housing 460 according to one embodiment of the invention. Theportable electronic device housing 460 represents a housing for aportable electronic device that encloses the board assembly 440illustrated in FIG. 4B. The sectional side view of the portableelectronic device housing 460 illustrates a sectional view alongreference line A-A′ illustrated in FIG. 4B.

The portable electronic device housing 460 represents a housing for aportable electronic device that contains the board assembly 440. Asillustrated in FIG. 4C, the barrier 442 provided on an upper surface ofthe printed circuit board 402 can be used as a seal between the inner,upper surface 461 of the portable electronic device housing 462 and theEMI shield can 408. More generally, the barrier 442 also seals downwardagainst the surface of the printed circuit board 402, one or moreelectronic devices 404 attached to the printed circuit board 402, and/orthe EMI shielding can 408. As shown, the EMI sealing can 408 enclosesthe electronic devices 404′. Other cross sectional views of the portableelectronic device housing 460 can illustrate the barrier 442 sealingdownward against the surface of (i) the printed circuit board 402,and/or (ii) the one or more electronic devices 404 attached to theprinted circuit board 402.

In addition, a first seal 462 and a second seal 464 can combine to forma back volume 466 behind a back side of the speaker 410. The first seal462 and the second seal 464 can create a seal between the back volume466 of the speaker 410 and a front volume 468 of the speaker 410. TheEMI shielding can 408 can include one or more openings (e.g., holes) inits upper surface adjacent the speaker 410. The openings enable soundwaves induced by the speaker 410 to propagate into the EMI shielding can408. The EMI shielding can 408 also includes at least one opening 470that allows the sound waves from the speaker 410 to exit the EMIshielding can 408. The opening 470 is an opening of or into the frontvolume 468. The portable electronic device housing 460 also includes anopening 472. The opening 472 is coupled to the front volume 468 for thespeaker 410 so that sound waves generated by the speaker 410 can exitthe portable electronic device housing 460. The opening 472 can be adedicated opening for the speaker 410 or can alternatively be an openingprovided for another purpose (e.g., connector opening).

FIG. 5A is an upper perspective view of a board assembly 500 accordingto still another embodiment of the invention. The board assembly 500 isgenerally similar to the board assembly 440 illustrated in FIG. 4B.However, the board assembly 500 further details that the EMI shieldingcan 408 can include other openings 502 besides the opening 412. With thebarrier 442, the opening in the EMI shielding can 408 provide a path forsound waves from the speaker 410 to pass out of the EMI shielding can408 to a remaining portion of a front volume. However, this implies thatthe volume within the EMI shielding can 408 is part of the front volumeand thus needs to be isolated from the back volume. Accordingly, to theextent that the EMI shield can 408 includes additional openings 502beyond the opening 412, the additional openings 502 need to be covered,filled or otherwise sealed to isolate the front volume inside the EMIshielding can 408 from the back volume outside the EMI shielding can408.

FIG. 5B is an upper perspective view of a board assembly 500′ accordingto still another embodiment of the invention. The board assembly 500′represents the board assembly 500 illustrated in FIG. 5A with theadditional openings 502 filled by a form-in-place material 520. In oneimplementation, the form-in-place material can be applied in a liquidfor so as to easily conform to irregular surfaces and then cure to forma solid seal. The resulting solid seal is typically compliant so as tofacilitate sealing with pressure on the seal. The form-in-place material520 can pertain to liquid silicone, unset epoxy, or foam.

In alternative embodiment, the openings 502 can be sealed by othermaterials. For example, the opening 502 can be cover, such as with anadhesive tape, or filled with a substance, such as silicone, metal orrubber.

FIG. 6 is a flow diagram of an assembly process 600 for a portableelectronic device according to one embodiment of the invention. Theassembly process 600 serves to assemble a housing for a portableelectronic device.

The assembly process 600 can initially obtain 602 a printed circuitboard. Electrical components can then be attached 604 to the printedcircuit board. In addition, an Electro-Magnetic Interference (EMI)shielding can is then attached 606 to the printed circuit board. Indoing so, the EMI shielding can typically covers one or more of theelectrical components attached to the printed circuit board. Next, aspeaker can be attached 608 to the EMI shielding can.

A form-in-place sealant can then be applied 612 to particular locations.For example, the form-in-place sealant can be applied to seal internalregions of the housing for the portable electronic device such that aback volume and a front volume for the speaker are distinctly formed.The form-in-place sealant can be applied over irregular surfaces,thereby allowing the demarcation between the back volume and the frontvolume to be flexibly established regardless of internal structure. Forexample, the form-in-place sealant can be provided over a plurality ofelectrical components formed on a printed circuit board (see, e.g., FIG.5A). As another example, the form-in-place sealant can be provided toseal openings with respect to the EMI shielding can (see, e.g., FIG.5B). In one implementation, the form-in-place sealant is applied as aliquid so that it is able to conform to irregular geometries. As anexample, the form-in-place sealant can be extruded into place.

After the form-in-place sealant has been applied 610, the form-in-placesealant is cured 612. In one implementation, the form-in-place sealantis cured 612 through use of heat. In another implementation, theform-in-place sealant is cured 612 through use of ultraviolet radiation.In still another implementation, the form-in-place sealant can be cured612 in an ambient environment.

Thereafter, the end product can be assembled 614. The end product,namely, a portable electronic device, has a housing that contains theassembled printed circuit board. In doing so, one more gaskets may beutilized to seal portions of the assembled printed circuit board tointerior surfaces of the housing so that a back volume and a frontvolume can be distinctly formed within the interior of the housing forthe portable electronic device. While gaskets can be utilized to certainseal certain areas, in other regions form-in-place material can be usedto seal or assist in sealing. For example, to the extent that sealing isto be provided over an irregular surface, conventional rubber gasketsare not able to provide an adequate seal; hence, the form-in-placematerial can be applied to seal such regions, alone or combination withone or more gaskets.

Although the assembly process 600 discussed above is for processing aprinted circuit board for a single housing at a time, it should beunderstood that the assembly process could also concurrently process anarray or sheet of printed circuit boards. For example, the operations602-612 can be perform on an array or sheet of printed circuit boards toproduce assembled printed circuit boards, and then final assembly of theindividual printed circuit boards can be performed at operation 614.

A portable electronic device as discussed herein may be a hand-heldelectronic device. The term hand-held generally means that theelectronic device has a form factor that is small enough to becomfortably held in one hand. A hand-held electronic device may bedirected at one-handed operation or two-handed operation. In one-handedoperation, a single hand is used to both support the device as well asto perform operations with the user interface during use. In two-handedoperation, one hand is used to support the device while the other handperforms operations with a user interface during use or alternativelyboth hands support the device as well as perform operations during use.In some cases, the hand-held electronic device is sized for placementinto a pocket of the user. By being pocket-sized, the user does not haveto directly carry the device and therefore the device can be takenalmost anywhere the user travels.

Additional information on use of piezoelectric speakers and EMIshielding cans within electronic device housings can be found in U.S.patent application Ser. No. 12/236,452, filed Sep. 23, 2008, entitled“ELECTROMAGNETIC INTERFERENCE SHIELDS WITH PIEZOS”, now U.S. Pat. No.8,126,170, which is herein incorporated herein by reference.

Also, as discussed above, a portable electronic device housing caninclude an opening (or aperture) so that sound waves generated by aspeaker can exit the portable electronic device housing. When theopening is provided for another purpose (e.g., connector opening), itcan be referred to as a dual-purpose aperture. Additional information ondual-purpose apertures can be found in U.S. patent application Ser. No.12/016,584, filed Jan. 18, 2008, and entitled “DUAL-PURPOSE HARDWAREAPERTURE”.

The advantages of the invention are numerous. Different embodiments orimplementations may, but need not, yield one or more of the followingadvantages. One advantage of certain embodiments of the invention isthat speakers can be used with compact housings for portable electronicdevices while using minimal space within the housings. Another advantageof certain embodiments of the invention is that improved acousticchambers can be provided within portable electronic device housingsusing non-dedicated areas and improved sealing techniques. For example,according to one embodiment, an acoustic chamber can yield high qualitysound without needing a dedicated area within a housing of a portableelectronic device.

The various aspects, features, embodiments or implementations of theinvention described above can be used alone or in various combinations.

The many features and advantages of the present invention are apparentfrom the written description. Further, since numerous modifications andchanges will readily occur to those skilled in the art, the inventionshould not be limited to the exact construction and operation asillustrated and described. Hence, all suitable modifications andequivalents may be resorted to as falling within the scope of theinvention.

1. A portable electronic device, comprising: a housing; a speakerprovided in said housing; a back volume for said speaker, said backvolume being formed from an area within said housing that is notdedicated to said back volume; and a front volume for said speaker, saidfront volume being formed from an area within said housing that is notdedicated to said front volume.
 2. A portable electronic device asrecited in claim 1, wherein said back volume is greater than the frontvolume.
 3. A portable electronic device as recited in claim 1, whereinsaid portable electronic device further comprises: a curable sealantthat is used to at least partially isolate said back volume from saidfront volume.
 4. A portable electronic device as recited in claim 3,wherein said curable sealant has a low viscosity when placed at certainregions within said housing and is thereafter cured.
 5. A portableelectronic device as recited in claim 1, wherein said speaker is a flatspeaker.
 6. A portable electronic device as recited in claim 1, whereinsaid speaker is a piezoelectric speaker.
 7. A portable electronic deviceas recited in claim 1, wherein said portable electronic device is ahandheld electronic device.
 8. A method for assembling a portableelectronic device having an internal acoustic back volume, said methodcomprising: obtaining a printed circuit board; attaching electricalcomponents to the printed circuit board; attaching an EMI shielding canto the printed circuit board such that the EMI shielding can is placedover one or more of the attached electrical components; attaching aspeaker to the EMI shielding can; applying a form-in-place sealant toone or more particular locations of the assembled printed circuit board;curing the form-in-place sealant; and thereafter assembling the portableelectronic device such that the assembled printed circuit board isprovided within a housing of the portable electronic device and suchthat the internal acoustic back volume is formed within the portableelectronic device housing and coupled to the speaker.
 9. A method asrecited in claim 8, wherein the EMI shielding can attached to theprinted circuit board includes one or more openings in at least one sideof the EMI shielding can, and wherein at least one of the one or moreparticular locations for the form-in-place sealant is at the one or moreopenings in the at least one side of the EMI shielding can.
 10. A methodas recited in claim 8, wherein the form-in-place sealant participates informing the internal acoustic back volume.
 11. A method as recited inclaim 8, wherein said applying the form-in-place sealant to the one ormore particular locations of the assembled printed circuit boardcomprises: extruding the form-in-place sealant onto the one or moreparticular locations.
 12. A method as recited in claim 8, wherein theform-in-place sealant is applied as a liquid sealant, and wherein saidcuring the form-in-place sealant causes the liquid sealant to harden toa solid sealant.
 13. A method as recited in claim 8, wherein saidattaching of the speaker to the EMI shielding can comprises: adheringthe speaker to a top surface of the EMI shielding can.
 14. A method asrecited in claim 13, wherein said adhering provides an adhesive around aperimeter of the speaker so as to secure and substantially seal thespeaker to the top surface of the EMI shielding can.
 15. A method asrecited in claim 14, wherein said adhering uses an adhesive tape.
 16. Amethod as recited in claim 14, wherein the top surface of the EMIshielding can includes at least one top opening, and wherein the speakeris secured and substantially sealed over the at least one top opening.17. A method as recited in claim 8, wherein the speaker is a flat,piezoelectric speaker.